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The author's goal in writing this text was to present a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing, and is highlighted by careful explanations, clear, simple language, and numerous fully-solved example problems. This work assumes a minimal knowledge of integrated circuits and of terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors.
Introduction to the basic processes common to all IC technologies is presented -Provides a base for understanding more advanced processing and what can and cannot be achieved through integrated-circuit fabrication. Major changes in the second edition of this text -Includes new or expanded coverage of lithography and exposure systems, trench isolation, chemical, mechanical polishing, shallow junctions, enhanced diffusion, copper Damescene processes, and process simulation.
A new chapter Chapter 11 on MEMs has been added. An Overview of Microelectronic Fabrication. Jaeger, is a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing and is highlighted by careful explanations, clean, simple language, and numerous fully solved example problems. The second edition includes an entirely new chapter on MEMS, as well as substantial modifications to the chapters on MOS and bipolar process integration. Also included is new or expanded coverage of lithography and exposure systems, trench isolation, chemical mechanical polishing, shallow junctions, transient enhanced diffusion, copper Damascene processes and process simulation.
Introduction to Microelectronic Fabrication Zoom. Solid State Devices. Microelectronic Devices. Contemporary Social Theory. Features Introduction to the basic processes common to all IC technologies is presented -Provides a base for understanding more advanced processing and what can and cannot be achieved through integrated-circuit fabrication.
A Historical Perspective. Basic Bipolar Processing. The Photolithographic Process. Etching Techniques. Photomask Fabrication. Exposure Systems.
Exposure Sources. Optical and Electron Microscopy. Further Reading. Thermal Oxidation of Silicon. The Oxidation Process. Modeling Oxidation. Factors Influencing Oxidation Rate. Dopant Redistribution During Oxidation. Masking Properties of Silicon Dioxide. Technology of Oxidation. Oxide Quality. Selective Oxidation and Shallow Trench Formation.
Oxide Thickness Characterization. Process Simulation. The Diffusion Process. Mathematical Model for Diffusion. The Diffusion Coefficient. Successive Diffusions. Solid-Solubility Limits. Junction Formation and Characterization. Sheet Resistance. Generation-Depth and Impurity Profile Measurement. Diffusion Simulation. Diffusion Systems. Ion Implantation. Implantation Technology. Mathematical Model for Ion Implantation.
Selective Implantation. Junction Depth and Sheet Resistance. Channeling, Lattice Damage, and Annealing. Shallow Implantation. Source Listing 6. Film Deposition. Chemical Vapor Deposition. Interconnections and Contacts. Interconnections in Integrated Circuits. Metal Interconnections and Contact Technology. Diffused Interconnections. Polysilicon Interconnections and Buried Contacts. Silicides and Multilayer-Contact Technology. The Liftoff Process.
Multilevel Metallization. Copper Interconnects and Damascene Processes. Packaging and Yield. Wafer Thinning and Die Separation. Die Attachment. Wire Bonding. MOS Process Integration. Silicon on Insulator. Bipolar Process Integration. The Junction-Isolated Structure.
Current Gain. Transit Time. Breakdown Voltages. Layout Considerations. Advanced Bipolar Structures. Other Bipolar Isolation Techniques. Mechanical Properties of Silicon. Bulk Micromachining. Silicon Etchants. Surface Micromachining. Silicon Wafer Bonding. IC Process Compatibility. Answers to Selected Problems. Your Basket.
Introduction to Microelectronic Fabrication
Introduction to Microelectronic Fabrication : Volume 5 of Modular Series on Solid State Devices
Introduction to Microelectronic Fabrication: Volume 5 of Modular Series on Solid State Devices